very low profile thickness 35um ED copper foil FOR Flexible Printed Circuit.
Products Specifications.
1) Thickness Range: 0.035mm.
2) standard width:1290mm.
3) ID: 76 mm,152 mm.
4) Cu Content: 99.8%.
VLP ED Copper Foil Characteristics.
1. Zinc-free.
2. Excellent physics of high elongation Performance.
Products use:
- Flexible Printed Circuit.
- LED layer of HDI .
Difference between rolled copper foil and electrolytic copper foil.
Process is difference: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process).
Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm.
RFQ:
Q1.what is the Internal diameter?
76/152/ custom.
Q2. Is it possible be zinc free copper foil?
Yes ,it is possible.
Q3. Is it the Fumigation carton box?
Yes ,it is .
Packaging & Delivery.
1. Packaging Details:wooden carton.
2. Delivery Detail:25-30days,depend on quantity.
Typical properties of VLP-S-B/R copper foil for FPC or inner layer of HDI.
|
Classification
|
Unit |
Requirement |
Test Method |
| Foil Designation |
/ |
|
1 |
H |
M |
1 |
IPC-4562A |
| Nominal thickness |
/ |
10um |
12um |
1/2 OZ (18um) |
3/4 OZ(25um) |
1 OZ(35um) |
IPC-4562A |
| Area Weight |
g/㎡ |
98±4 |
107±4 |
153±5 |
228±8 |
285±10 |
IPC-TM-650
2.2.12.2
|
| Purity |
％ |
≥99.8 |
IPC-TM-650
2.3.15
|
| Foil Profile |
Shiny side(Ra) |
սm |
≤2.5 |
≤2.5 |
≤2.5 |
≤2.5 |
≤2.5 |
IPC-TM-650
2.3.17
|
| Matte side(Rz) |
um |
≤2.5 |
≤2.5 |
≤2.5 |
≤2.5 |
≤2.5 |
| Tensile Strength |
R.T.(23℃) |
Mpa |
≥300 |
≥300 |
≥300 |
≥300 |
≥300 |
IPC-TM-650
2.3.18
|
| H.T.(180℃) |
Mpa |
≥200 |
≥200 |
≥200 |
≥200 |
≥200 |
| Elongation |
R.T.(23℃) |
％ |
≥4 |
≥5 |
≥6 |
≥8 |
≥10 |
IPC-TM-650
2.3.18
|
| H.T.(180℃) |
％ |
≥5 |
≥6 |
≥7 |
≥8 |
≥8 |
| Peel Strength(FR-4) |
N/mm |
≥0.8 |
IPC-TM-650
2.4.8
|
| Ibs/in |
≥4.6 |
| Pinholes&porosity |
Number |
No |
IPC-TM-650
2.1.2
|
| Anti-oxidization |
R.T.(23℃) |
180days |
/ |
| H.T.(200℃) |
60 Minutes |
/ |
Remark:Standard Width 1295mm,max width 1380(±1)mm,May according to the customer request tailor.We test the peel strength with PI ,please reconfirm with your pp.
Product Tags:
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Low Profile ED Copper Foil Thickness 35um For Flexible Printed Circuit Images
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